Uttar Pradesh Electronics Component Manufacturing Policy – 2025 (First Amendment)

Key Attractions of the Policy

Unmatched Incentives

• Top-up Benefits: Equal to Central ECMS incentives — offering a double advantage for investors.
• Capital Subsidy up to 20% for units not covered under Central ECMS.
• Customized Mega Packages on a case-to-case basis for investments above ₹2,000 Crore.

Extra Push for Strategic Components

• Additional 2% incentive for Lithium-ion cell manufacturing (digital applications) with local sourcing.
• Additional 1% incentive for Multi-layer PCB manufacturing with local laminates.

Comprehensive State Support

• Land Subsidy: 25% subsidy; up to 50% in Bundelkhand & Purvanchal regions.
• 100% Stamp Duty & Electricity Duty Exemption — significantly reducing setup costs.
• Interest Subsidy, EPF Reimbursement & Patent Cost Reimbursement.
• Logistics & R&D Support — enabling innovation-driven growth.

Focus Segments

A. Sub-Assemblies

• Display Module Sub-Assembly
• Camera Module Sub-Assembly

B. Bare Components

• Non-SMD Passive Components
• Electro-Mechanicals for Electronic Applications
• Multi-layer PCB
• Li-ion Cells for Digital Applications (excluding storage and mobility)
• Enclosures for Mobile, IT Hardware Products & Related Devices

C. Selected Bare Components

• HDI / MSAP / Flexible PCB
• SMD Passive Components

Supply Chain Ecosystem & Capital Equipment

• Supply Chain of Sub-Assemblies (A), Bare Components (B) & (C)
• Capital Goods used in Electronics Manufacturing, including their Sub-Assemblies & Components